Metal powder in the natural environment is caused by the oxidation of unstable quality diamond blade important factor. Although it is already using a metal powder reduction process, but usually before the mixing elemental metal powder to be restored. Restored even after mixing powder, cold, loading mode, pressing and other follow-up process, the surface area of the powder is a huge step up the process of the existence of secondary oxidation powder in hot and humid areas, this brings secondary oxidation consequences particularly evident. We can do that: before the reduction in hot pressing process is the most thorough reduction, but also very necessary. We can do that: before sintered powder pre-alloyed degree higher the better, but also very necessary. In order to solve the above two issues, we have adopted a cold head temperature reduction process. After high temperature reduction of the tip, the performance is quite stable. Continuous sampling over five months to do sawing tracking test, each batch of the same ingredients blade performance is very stable, almost no difference. Right ingredients for fine adjustment heads, can be seen in the cutting wheel test significant differences. This is because the various factors are excluded after the recipe to make small adjustments to the blade performance will reflect the change. We did cut test for comparison cutting head piece done after the reduction step of the tip after tip than not done head to restore process, whether it is the sharpness or life has improved significantly. Comparative tests to improve the rate reached 30% and 55%. Comparison of experimental results are: (head size 40x3.2x8, saw blade diameter 350 mm, spindle speed of 2850 rev / min) Sintered diamond blade in the manufacturing process, the most attention and should solve the problem of oxidation of the metal powder. Same formulation head, a quality instability, powder oxidation is the main reason. After the reduction process using cold head, excluding the impact of natural environmental factors, so that the metal powder is thoroughly restored, and also produces the effect of a pre-alloy, is stable and improving product quality protection. After high temperature reduction process a wide range of applications, will make China's metal-bonded diamond products quality greatly improved.
Overall thin diamond cutting discs Ultra-thin cutting discs attract the industry's best technical staff involved in the production and R & D, to provide customers with quality products, the company's operations is the belief of the business integrity, quality of life of the principle of Samples of the company's success rate to get good results. Provide various types of precision thin diamond cutting disc / Precision CBN cutting diamond thin film and the overall cut slices. Diamond cutting disc production to applications include: inorganic non-metal cutting industry, such as glass, ceramics, stone, etc.. CBN blade applications include: a variety of metal cutting, such as cemented carbide and stainless steel. Using high precision, narrow kerf, sharp, according to customer requests in the case, the deployment of a variety of performance cutting discs, with the greatest ability to provide customers with the best quality products. Overall we use cutting disc diamond cutting characteristics, diamond powder produced all of Europe and the United States, high-quality materials to ensure cutting precision, good material to ensure the diamond thin cutting discs cut from the beginning to the end life can be remain extremely sharp, and this is the biggest advantage of our products to ensure that customers do not have in the course of frequent replacement of cutting discs, but also greatly save you time, waste of resources, but also for you to save a lot of costs. Detailed breakdown of processing range: Glass Material: various glass / optical glass / quartz glass / glass / gems / crystal / jade / diamond / precious stones / Precision Diamond Ceramic materials: alumina / white / black ceramic / silica / glass products / clay pipes, etc. / Ceramic / crystal / ceramic abrasive materials: refractory / SiC / Whetstone and other magnetic materials: core / magnetic tablets / rare earth neodymium / ferrite magnet Semiconductor materials: SiC / silicon / solar / semiconductor packaging components / compound semiconductor wafer / Electronic Components / chip LED substrate / integrated IC Package / integrated electronic chip / resistors, capacitors, diodes, crystal oscillators and other metal materials: high-speed steel, tool steel, alloy steel, tool steel, bearing steel, stainless steel and other metal materials brittle: Carbide (tungsten steel YG8), etc.