Economic & Technological Development Zone,
450016, Zhengzhou, China
Tel: 0086 371 62003286
Fax: 0086 371 62003286
E-mail: [email protected]
Silicon Wafer Back Grinding Wheels
Silicon Wafer Back Grinding Wheels
Silicon wafer back grinding wheels are used for trimming of silicon wafers. Our back grinding wheels are designed used on Japan, Germany and China-made grinders. High efficiency, high precision and easy processing.
Application: Semiconductor silicon.
Workpiece material: Monocrystalline silicon and other semiconductor materials.
Wafer Back & Front Rough and Finish Grinding.
Backing grinding wheels with LED substrate are mainly used for backing thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Application: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece material: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.